overview

Physics and fabrication of semiconductor devices.

selected publications
Academic Articles33
Chapters4
  • Kirschman, R. (1998). A GaP MESFET for High Temperature Applications. High-Temperature Electronics. (pp. 430-432). IEEE.
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  • Kirschman, R. (1998). Materials for 300500C Magnetic Components. High-Temperature Electronics. (pp. 717-720). IEEE.
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  • Kirk, W. P., Reed, M. A., Bate, R. T., Frensley, W. R., Hasslacher, B., Jedrzejek, C., ... Weichold, M. H. (1992). Organizing and Program Committee. Nanostructures and Mesoscopic Systems. (pp. xiii-xiii). Elsevier.
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Conference Papers27
patents
Patents3
  • Yue, W. K., Parker, D. L., & Weichold, M. H. (1995). Oxidized porous silicon field emission devices.
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  • Weichold, M., Peterson, G., & Mallik, A. (1993). Vapor deposited micro heat pipes.
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  • Weichold, M. H., Kinard, W. B., & Kirk, W. P. (1992). Gate adjusted resonant tunnel diode device and method of manufacture.
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Email
m-weichold@tamu.edu
First Name
Mark
Last Name
Weichold
mailing address
Texas A&M University; TAMU 3127
College Station, Texas 77845-3127
USA