overview

My areas of research are highly interdisciplinary and include automated assembly system design, control, integration, diagnosis, and preventative maintenance; optical and infrared imaging for product/process characterization and failure prediction; micro/nano manufacturing; and design of technology for automation and robotics education.

education and training
selected publications
Academic Articles69
  • Wang, J., Ruilova, M., & Hsieh, S. (2022). A web-based platform for automated vat photopolymerization additive manufacturing process. The International Journal of Advanced Manufacturing Technology. 119(3-4), 2721-2742.
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  • Hsieh, S., Wang, A. R., Madison, A., Tossell, C., & de Visser, E. (2022). Adaptive Driving Assistant Model (ADAM) for Advising Drivers of Autonomous Vehicles. ACM Transactions on Interactive Intelligent Systems. 12(3), 1-28.
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  • Shi, X., Hsieh, S., & Romero, R. (2021). FEA and Machine Learning Techniques for Hidden Structure Analysis.. Sensors (Basel). 21(15), 5159-5159.
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  • Miao, G., Hsieh, S., Segura, J. A., & Wang, J. (2019). Cyber-physical system for thermal stress prevention in 3D printing process. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY. 100(1-4), 553-567.
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  • Zhou, X., Hsieh, S., & Wang, J. (2019). Accelerating extrusion-based additive manufacturing optimization processes with surrogate-based multi-fidelity models. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY. 103(9-12), 4071-4083.
Conference Papers121
  • Hsieh, S. (2021). Design and Evaluation of Collaborative Lab for Robot Programming. 2021 ASEE Virtual Annual Conference Content Access Proceedings, 2021 ASEE Virtual Annual Conference Content Access Proceedings.
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  • Shi, X., & Hsieh, S. (2021). Infrared imaging and machine learning techniques for plant root location and depth prediction. THERMOSENSE: THERMAL INFRARED APPLICATIONS XLIII, Thermosense: Thermal Infrared Applications XLIII. 11743, 1174303-1174303-14.
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  • Hsieh, S. (2020). Remotely Accessible 3-D Printer for Teaching CNC Programming: Lessons Learned. 2020 ASEE Virtual Annual Conference Content Access Proceedings, 2020 ASEE Virtual Annual Conference Content Access Proceedings.
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Reports1
chaired theses and dissertations
Email
hsieh@tamu.edu
First Name
Sheng-Jen
Last Name
Hsieh
mailing address
Texas A&M University; Engineering Technology; 3367 TAMU
College Station, TX 77843-3367
USA