education and training
selected publications
Academic Articles134
  • Chen, Y., Yuan, T., Bae, S. J., & Kuo, Y. (2021). Two-level differential burn-in policy for spatially heterogeneous defect units in semiconductor manufacturing. Computers & Industrial Engineering. 162, 107768-107768.
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  • Fan, W., Liu, P., Kuo, P., Chang, C., Liu, I., & Kuo, Y. (2021). Numerical Analysis of Oxygen-Related Defects in Amorphous In-W-O Nanosheet Thin-Film Transistor. Nanomaterials. 11(11), 3070-3070.
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  • Su, J. Q., Li, M., & Kuo, Y. (2020). Metal Capping Layer Effects on Electromigration Failure Phenomena of Plasma Etched Copper Lines. ECS Journal of Solid State Science and Technology. 9(10), 104009-104009.
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  • Yuan, T., Bae, S. J., & Kuo, Y. (2020). Statistical Models of Overdispersed Spatial Defects for Predicting the Yield of Integrated Circuits. IEEE Transactions on Reliability. 69(2), 510-521.
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  • Liu, L., Wang, Y., Lin, Y., Zhang, X., & Kuo, Y. (2020). Si Wafer Dopant Concentration Effect on Light Emission of Solid State Incandescent Light Emitting Devices. ECS Journal of Solid State Science and Technology. 9(3), 036004-036004.
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Conference Papers154
  • Lin, W., & Kuo, Y. (2021). Electrical and Optical Characteristics of SSI-LED Made from Capacitor Containing Tri-Layer WOx Embedded Zr-Doped HfOx Gate Dielectric. ECS Journal of Solid State Science and Technology. 10(12), 126001-126001.
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  • Shukla, A., & Kuo, Y. (2020). Study of Electrothermal Characteristics and Emitted Light Characteristics of SSI-LED. ECS Journal of Solid State Science and Technology. 9(6), 065017-065017.
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  • Li, M., Su, J. Q., & Kuo, Y. (2019). Capping Layer Effect on Lifetime of Plasma Etched Copper Lines. ECS Transactions. 89(3), 87-92.
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  • Kuo, Y. (2019). Co-Planar Nano-Resistor Devices. ECS Transactions. 89(3), 71-76.
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  • Kuo, Y., & Zhang, S. (2019). CommunicationCo-Planar Structured Nano-Resistor Devices. ECS Journal of Solid State Science and Technology. 8(12), Q223-Q225.
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in the news
patents
Patents3
chaired theses and dissertations
Email
yuekuo@tamu.edu
First Name
Yue
Last Name
Kuo
mailing address
Texas A&M University; Chemical Engineering; 3122 TAMU
College Station, TX 77843-3122
USA