Heat transfer in channels simulating cooling passages of electronic components | Book individual record
abstract

Heat transfer in channels simulating cooling passages of electronic equipment were studied numerically. In this paper a brief summary of solution procedure and salient results for laminar developing and periodically fully developed flow are presented. An alternative out flow boundary condition for temperature field in the considered geometry was proposed and its superiority was established. In laminar periodically fully developed flow the wall conduction (K{sub s}/K{sub f}) increases heat transfer up to a point unlike in periodically fully developed turbulent flow.

authors
author list (cited authors)
Anand, N.K. [Texas A and M Univ., College Station, TX (United States). Dept. of Mechanical Engineering], .., & Kim, S.H. [Kei Muyung Univ., Taegu (Korea, Republic of). Dept. of Mechanical Engineering], ..
publication date
1996
keywords
  • Theoretical Data
  • 42 Engineering Not Included In Other Categories
  • Laminar Flow
  • Electronic Equipment
  • Heat Transfer
  • Cooling
  • Numerical Analysis