Two-dimensional turbulent heat transfer between a series of parallel plates with surface mounted discrete block heat sources was studied numerically. The computational module was subjected to periodic conditions in the stream-wise direction and repeated conditions in the cross-stream direction. These channels resemble cooling passages in electronic equipment. The k-ε model was used for turbulent closure and calculations were made for a wide range of independent parameters (Re, Ks/Kf, s/w, d/w and h/w). The effect of substrate conduction was found to reduce the block temperature by redistributing the heat flux and to reduce the overall thermal resistance of the module. It was found that the increase in the Reynolds number decreased the thermal resistance; however, there is an advantage in adopting the strategy of increasing the substrate conduction to reduce thermal resistance since there is no additional pressure drop penalty. Finally, correlations for the friction factor(f) and thermal resistance(R) in terms of independent parameters were developed.